Cleanroom Automation Solutions for the Semiconductor Packaging and Testing Industry

Industry Pain Points 

Cleanroom environments (Class 1000-10000) require low-dust-emission equipment. 

Fragile products (thin substrates, wafer-level packaging) necessitate non-contact transfer. 

Precision integration with high-accuracy equipment such as die bonders and wire bonders is essential. 

Deployment of Yongxinda Semiconductor-Grade Peripheral Equipment:  Core Equipment Configuration:  Automated Tray Loader (Custom-built): Automated tray feeding with precision robotic handling  Precision Buffer Machine: Servo-driven with soft conveyor belts for vibration-free buffering  Remote Board Loader (Custom-built): Remote loading outside cleanrooms to minimise personnel entry  Intelligent Stacker: Automated stacking and film covering of finished products to prevent contamination  Technical Advantages:  Fully enclosed structure + FFU filtration unit to meet cleanliness requirements  Integrated electrostatic elimination with ion balance within ±10V  Vision positioning system with alignment accuracy of ±0.05mm   Application Value: Fully enclosed structure + FFU filtration units meeting cleanliness requirements

Integrated electrostatic elimination with ion balance within ±10V

Vision positioning system with alignment accuracy of ±0.05mm

Application Value:

40% reduction in manpower, 25% increase in cleanroom utilisation rate