Large-scale PCBA Solutions for 5G Communication Equipment

Industry ChallengesPCB dimensions exceed 600mm, rendering traditional equipment incompatibleMulti-layer boards and thick copper boards present significant weight, demanding high load-bearing capacity during transferComplex processes such as fixture reflow and board separation require supportSolution

Cleanroom Automation Solutions for the Semiconductor Packaging and Testing Industry

Industry Pain PointsCleanroom environments (Class 1000-10000) require low-dust-emission equipment.Fragile products (thin substrates, wafer-level packaging) necessitate non-contact transfer.Precision integration with high-accuracy equipment such as die bonders and wire bonders is es

Automotive Electronics Zero-Defect Production Solution

Industry ChallengesStringent quality systems (IATF 16949) demand process controlLarge product dimensions and weight necessitate high transmission stabilityRequires specialised environmental controls such as anti-static and dust-proofingSolutionsImplementation of Yongxinda's automotive electronic

Consumer Electronics Solution

Consumer Electronics SolutionFunction:Support customer highly competitve,floor space constraint. shortproducts life cycle, fastest time to market, our board handling systemadopt compact design, very high machine uptime, easy to maintenance.support quick and autonomous product change over with link t